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Innovative Designs for Optimizing 112G+ BGA Fan-Out and Connector Footprint Crosstalk WhitepaperMaking 400G A Reality
CDFP, OSFP, QSFP-DD and COBO form factors support the emerging Ethernet standardProduct Group
Thermal Bridge Technology for Input/Output (I/O) Applications
Our innovative thermal bridge technology provides up to 2x better thermal resistance over traditional thermal technologies such as gap pads or thermal pads.Product Group
Internal Cabled Interconnects
Our internal cabled interconnects can provide a solution to data rate increase challenges.Big Ideas for Even Bigger Data
TE's cutting-edge solutions can anticipate today’s big data needs – and account for tomorrow’s forward-looking designs.Product Group
STRADA Whisper High Speed Backplane Connectors
The STRADA Whisper backplane family transfers data up to 112 Gbps to achieve efficient future system upgrades without costly backplane or midplane redesigns.Product Category
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Our pluggable I/O products are designed for speed, density, and flexibility.Industries
5G Solutions - The Future is Fast
With the evolution of mobile communication, the fifth-generation communication technology emerged in the era of mobile Internet.112G High Speed Data
Electrical interfaces at 112 Gbps are a critical enabler of faster, more efficient and cost-effective networks and data centers. TE is at the forefront of developing these solutions with industry leaders to bring our customers the fastest speeds combined with the best performanceOSFP Connectors & Cable AssembliesQSFP-DD InterconnectsActive Optical Cable AssembliesSFP Connector Types: SFP-DD, SFP28, SFP56, SFP112, SFP+, zSFP+LEMBAS USB ModemDownload White Paper
Innovative Designs for Optimizing 112G+ BGA Fan-Out and Connector Footprint Crosstalk WhitepaperMaking 400G A Reality
CDFP, OSFP, QSFP-DD and COBO form factors support the emerging Ethernet standardProduct Group
Thermal Bridge Technology for Input/Output (I/O) Applications
Our innovative thermal bridge technology provides up to 2x better thermal resistance over traditional thermal technologies such as gap pads or thermal pads.Product Group
Internal Cabled Interconnects
Our internal cabled interconnects can provide a solution to data rate increase challenges.Big Ideas for Even Bigger Data
TE's cutting-edge solutions can anticipate today’s big data needs – and account for tomorrow’s forward-looking designs.Product Group
STRADA Whisper High Speed Backplane Connectors
The STRADA Whisper backplane family transfers data up to 112 Gbps to achieve efficient future system upgrades without costly backplane or midplane redesigns.Product Category
Pluggable I/O Connectors and Cages
Our pluggable I/O products are designed for speed, density, and flexibility.Industries
5G Solutions - The Future is Fast
With the evolution of mobile communication, the fifth-generation communication technology emerged in the era of mobile Internet.112G High Speed Data
Electrical interfaces at 112 Gbps are a critical enabler of faster, more efficient and cost-effective networks and data centers. TE is at the forefront of developing these solutions with industry leaders to bring our customers the fastest speeds combined with the best performancePrivacyUS PrivacySee Support DetailsDistributorsSuppliersSupplier DiversityAuthorized Distributors & ResellersProduct FAQsSamples FAQsTE Store FAQsTerms and Conditions of SaleSamples Terms and ConditionsFacebookLinkedInYouTubeInstagramFacebookLinkedInYouTubeInstagramTerms of UsePrivacyUS PrivacyCookie PolicyAccessibilitySecuritySite Map
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